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30.11.2016
Proper preparation of solder mask layer

Proper preparation of solder mask layer

A common mistake in printed circuit board documentation is an incorrectly prepared solder mask layer.   Its correct implementation make it possible to eliminate problems at the PCB production stage and also in the process of component installation in circuits. It is inappropriate to prepare the mask layers flush with a pad to be exposed. The situation whereby there are exposures in customer sets that expose the mass or are very close is also unacceptable. All components to be tinned or gilded must be exposed by a mask enlarged by at least 6 mils in relation to the component in the mosaic. In other words – the minimum exposure on the mask is 3 mils on each ...
17.11.2016
IPC circuit classes

IPC circuit classes

According to the IPC-A-600 document, there are three general classes of final products. The purpose of this classification was to identify the following differences: manufacture process technological advancement operational reliability requirements depending on the board purpose. In addition, this document defines three levels of quality: target condition – in many cases it is close to perfect. While this is the desired condition, it is not always achievable and may not be necessary to ensure the reliability of the board in its service environment; acceptable condition – indicates that the condition depicted, while not...
10.11.2016
What technical standards should the PCB comply with?

What technical standards should the PCB comply with?

The most common specifications used within the printed circuit boards production are the documents issued by the IPC. The main set: IPC-6010 “Family of Board Performance Documents" includes the following specifications: 6011: Generic Performance Specification for Printed Boards, 6012C: Qualification and Performance Specification for Rigid Printed Boards, 6013C: Qualification and Performance Specification for Flexible Printed Boards, 6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures, 6017: Qualification and Performance Specification for Printed Boards C...
16.09.2016
Technological challenges in PCB production

Technological challenges in PCB production

Each year proves that European PCB market is more and more demanding. Industry analysis and reports as well as signals from domestic producers show it without a doubt. The general tendency to minimize electrical objects, expansion of high technology into almost every sphere of life and the non-stoppable competition of Far East manufacturers, forces the PCB producers to increase standards, especially in terms of technology . The advanced technology followed by the competitive price level is becoming one of the most important element of keeping the client.   The advanced technology includes more precise DRC parameters on inner and outer copper layers (spacing between th...