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Proper preparation of PCB outline
A common mistake in printed circuit board documentation is an incorrectly prepared outline layer. A properly prepared outline is shown in Fig. 1 – the line with constant width clearly indicating the printed circuit perimeter edge. Fig. 2 additionally shows it paired with a mosaic layer. Fig. 1. Correct printed circuit boards outline (through-holes are also visible). Fig. 2. Correct printed circuit board outline paired with mosaic layer (through-holes are also visible). Setting an outline layer so prepared on the project’s remaining layers (mosaic, silkscreen,...
PCBs production documentation – how is it created and what are its contents?
While designing a printed circuit board, the designer develops a vision of a printed circuit of which the connection network will ensure its correct and faultless operation. This vision is reflected in the electronic version of the design, prepared in a CAD program, and the design documentation generated for the printed circuit manufacturer. On its basis, the proper production documentation is created to be used at the particular stages of circuit production. It includes, for example, films for reproducing the particular circuit layers (mosaics, soldermasks, silkscreens), programs for mechanical treatment (drilling, milling and scoring) for CNC machines and programs for optical and el...
Thick copper layers in printed circuit boards. Application and design
Printed circuit boards (PCBs) are most often used in low-voltage electronic systems and devices, which are products that have been continuously minimised in size by reducing the dimensions of mosaic components. PCBs have been increasingly used in high current power devices with electrically conductive networks of high current density. A specific characteristic of PCBs is the large thickness of their copper foil, which amounts to 105 µm or higher. The following paper presents the typical applications of PCBs with thick mosaic layers, their advantages, design principles and processing (technological) limitations. The information enables correct design and production of the P...
Structure, characteristics and design of multilayer printed circuit boards
Modern electronic devices are expected to deliver high functionality, small form factors and high reliability. These features are achieved with large numbers of miniature and composite integrated circuits which are interconnected by complex networks. Mapping those IC's on a typical double-sided printed circuit board is not possible due to e.g. the required and limited dimensions of the PCB alone; hence multilayer PCBs are necessary, and sometimes in HDI (High Density Interconnect) versions that typically include 4, 6, 8 or more conductors layers, the so-called mosaics. This paper presents the structure, manufacturing and proper design methods of multilayer PCBs. Following the latt...