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Advanced technologies of printed circuit boards
The complexity of electronic circuits has been growing, and the emerging new technologies raise the bar for these products. The parameters of PCBs (printed circuit boards), which are components of electronic equipment, must also follow the demands. Hence PCB designers should be aware what solutions they can use, what are the advantages and limitations thereof, and how to make the best use of them. This paper presents the advanced technologies and requirements applied in e.g. HDI circuits, as well as the applications of additional external coatings with non-standard machining methods. The finish of the article explains what parameters define the quality of manufactured PCBs. ...
Aluminium core PCBs: parameters, applications and design
The increasing complexity of electronic circuits and their component density on printed circuit boards has begun causing difficulties to engineers and designers in proper dissipation of the head generated in high-power semiconductor components. The standard FR4 glass-reinforced epoxy laminates, high-power components adapted for THT assembly and typical heat sinks significantly raise the production costs, dimensions and weight of devices. Fig. 1. Comparison of an identical design assembled on (a) the FR4 laminate and (b) the aluminium core. Using laminates on an IMS (Insulated Metal Substrate) in the form of an aluminium core to manufacture ...
Buried and blind vias and using their advantages in electronic device projects
The PCBs applied in modern electronic equipment grow in complexity: designers must pack more and more components on increasingly smaller surfaces. Buried and blind vias are enable miniaturisation with a simultaneous growth of complexity. These solutions have been offered by Techno-Service for years. In order to fully utilize the potential of vias, it is good to better understand their differences, principles of proper PCB design with the vias, and the benefits of the solution. Fig. 1. Diagram of a PCB with blind via from layer 1 to layer 2. The nomenclature of new technological solutions is immense. One of the main concepts is blind via. It...